GD32VW553系列

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概述

GD32VW553系列MCU支持Wi-Fi 6及Bluetooth LE 5.2无线连接。GD32VW553系列MCU集成的2.4GHz Wi-Fi 6射频模块采用IEEE 802.11ax标准，并向下兼容IEEE 802.11b/g/n标准，可以适用于不同的网络环境。片上集成的Bluetooth LE 5.2射频模块，能够以最新的蓝牙规范延长通信距离、提高吞吐量、增强安全性和节省电能。面向实时处理和高效通信需求，GD32VW553系列MCU采用了全新的开源指令集架构RISC-V处理器内核，主频可达160MHz。GD32VW553系列集成了高达4MB Flash及320KB SRAM，另有32KB可配置指令高速缓存(I-Cache)，大幅提升了CPU处理效率。不仅具备出色的无线性能，芯片还配置了丰富的通用有线接口。GD32VW553还具备多重安全特性以简化高性能无线设备的安全连接和管理，从而进一步提升系统安全强度。供电电压1.8V~3.6V，并提供了85℃~105℃宽温选择，以满足工控互联、照明设备以及插座面板等高温场景应用所需。

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GD32VW553

支持Wi-Fi 6和Bluetooth LE 5.2无线连接协议
采用RISC-V内核, 主频高达160MHz
存储容量支持4MB Flash以及320KB SRAM

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Part No.	Core	Series	Package QFN40 QFN32	Max Speed (MHz)	Flash (Bytes) 2048K 4096K	SRAM (Bytes)	I/O up to 28 up to 21	GPTM (32bit)	GPTM (16bit)	Advanced TM (16bit)	Basic TM (16bit)	SysTick (64bit)	WDG	RTC	USART+UART	I2C	QSPI	SPI	12bit ADC Units (CHs)	IEEE 802.11	Bluetooth
GD32VW553KIQ7	RISC-V	GD32VW553	QFN32	160	2048K	320K	up to 21	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553KMQ7	RISC-V	GD32VW553	QFN32	160	4096K	320K	up to 21	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553HIQ7	RISC-V	GD32VW553	QFN40	160	2048K	320K	up to 28	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553HMQ7	RISC-V	GD32VW553	QFN40	160	4096K	320K	up to 28	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553KIQ6	RISC-V	GD32VW553	QFN32	160	2048K	320K	up to 21	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553KMQ6	RISC-V	GD32VW553	QFN32	160	4096K	320K	up to 21	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553HIQ6	RISC-V	GD32VW553	QFN40	160	2048K	320K	up to 28	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2
GD32VW553HMQ6	RISC-V	GD32VW553	QFN40	160	4096K	320K	up to 28	2	2	1	1	1	2	1	1+2	2	1	1	1(9)	(b/g/n/ax) HT20	BLE 5.2

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